Mechanical model of nanoparticles for material removal in chemical mechanical polishing process
نویسندگان
چکیده
منابع مشابه
Material Removal Mechanism in Chemical Mechanical Polishing: Theory and Modeling
The abrasion mechanism in solid-solid contact mode of the chemical mechanical polishing (CMP) process is investigated in detail. Based on assumptions of plastic contact over wafer-abrasive and pad-abrasive interfaces, the normal distribution of abrasive size and an assumed periodic roughness of pad surface, a novel model is developed for material removal in CMP. The basic model is = removed, wh...
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A new contact-mechanics-based model for chemical–mechanical polishing is presented. According to this model, the local polish rate is controlled by the pressure distribution between features on the wafer and the polishing pad. The model uses an analysis based on the work by Greenwood to evaluate this pressure distribution taking into account pad compliance and roughness. Using the model, the e2...
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ژورنال
عنوان ژورنال: Friction
سال: 2016
ISSN: 2223-7690,2223-7704
DOI: 10.1007/s40544-016-0112-z